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AMD will reportedly use glass substrates for CPUs between 2025 and 2026

AMD will reportedly use glass substrates for CPUs between 2025 and 2026
AMD will reportedly use glass substrates for CPUs between 2025 and 2026

According to an unconfirmed report from Business Korea, AMD intends to use glass substrates for its ultra-high-performance system-in-packages (SiPs) between 2025 and 2026. The report claims the company will collaborate with “global component companies” on the project. While glass substrates for processors are still exotic today, they may be closer to adoption than one might think.

Glass substrates offer significant advantages over traditional organic substrates, which is why Intel, Samsung, and several other companies are racing to use them in the second half of the decade. The exceptional flatness of glass substrates enables improved depth of field for lithography and dimensional stability, making them ideal for interconnects in advanced multi-chiplet SiPs. In addition, glass substrates offer superior thermal and mechanical strength, making them well suited for high-temperature and long-life applications such as data center SiPs. Still, glass substrates make a lot of sense for companies like AMD, Intel, and Nvidia.

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